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Hanmi Semiconductor held the groundbreaking ceremony for its seventh TC Bonder factory in Seo-gu, Incheon. The two-story building with 14,400 m² floor area is scheduled for completion in Q4 2025 and will manufacture TC Bonders for HBM3E memory to be supplied to NVIDIA and Broadcom.
“Hanmi Semiconductor has started construction of an additional TC Bonder factory to have production capacity ahead of the demand in the HBM market.”biz.chosun.com
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