Hanmi Semiconductor wins HBM equipment order from SK Hynix

Hanmi Semiconductor announced it signed a contract with SK Hynix to supply TC bonder equipment for HBM3E 12-layer product manufacturing, worth about 10.8 billion won, with a contract period until July 1, 2025.

“Hanmi Semiconductor announced on the 14th that it has signed a contract with SK Hynix to win equipment for manufacturing high-bandwidth memory (HBM) worth about 10.8 billion won.”mk.co.kr

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• mk.co.krHanmi Semiconductor announced on the 14th that it has signed a contract with SK Hynix to win equipme.. - MKJan 14, 2025

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