Hanmi Semiconductor signs 22.6 billion KRW TC Bonder contract with Micron

Hanmi Semiconductor has secured a supply contract worth 22.6 billion KRW from Micron Technology for its Dual TC Bonder Griffin equipment used in HBM3E memory production for AI semiconductors.

“Hanmi Semiconductor announced that it has secured a supply contract worth 22.6 billion KRW from the U.S. memory semiconductor company Micron Technology for the production of AI semiconductor high-bandwidth memory (HBM) using the ‘Dual TC Bonder Griffin’.”asiae.co.kr

• 1 source
• asiae.co.krHanmi Semiconductor Signs TC Bonder Contract for HBM with US Micron... 'Only Samsung Left' - The Asia Business DailyApr 11, 2024

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