ESMC breaks ground on semiconductor fab in Dresden, Germany

ESMC, a joint venture between TSMC, Bosch, Infineon and NXP, held a groundbreaking ceremony for its first semiconductor fab in Dresden, Germany. Total investments are expected to exceed €10 billion, with a monthly production capacity of 40,000 300mm wafers and around 2,000 direct jobs.

“Together with our partners, Bosch, Infineon and NXP, we are building our Dresden facility to meet the semiconductor needs of the rapidly growing European automotive and industrial sectors.”nxp.com

• 3 sources
• nxp.comESMC Breaks Ground on Dresden Fab | NXP SemiconductorsTSMCAug 19, 2024
• finance.yahoo.comGroundbreaking for new chip factory in German city of DresdenDPAAug 20, 2024
• industrialinfo.comEurope Approves Germany's $5.6 Billion Package for New Chip PlantAug 29, 2024

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