TSMC, Bosch, Infineon and NXP plan €10bn semiconductor fab in Dresden

TSMC, Bosch, Infineon Technologies and NXP Semiconductors announced a joint venture to build a 300mm semiconductor fab in Dresden, Germany, with total investments exceeding €10bn. TSMC will own 70% and the others 10% each. Production is scheduled to begin by end of 2027.

“This investment in Dresden demonstrates TSMC’s commitment to serving our customers’ strategic capacity and technology needs.”automotivepowertraintechnologyinternational.com

• 2 sources
• automotivepowertraintechnologyinternational.comJoint venture announced to bring advanced semiconductor manufacturing to Europe | Automotive Powertrain Technology InternationalCallum Brook-JonesAug 9, 2023
• packaginginsights.comTSMC, Bosch, Infineon and NXP invest €10B to strengthen Europe’s semiconductor manufacturing ecosystemNatalie SchwertheimAug 10, 2023

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