Resonac launches US-JOINT semiconductor packaging R&D consortium in Union City, California

Resonac Corporation unveiled a new consortium of ten partners called 'US-JOINT' for semiconductor back-end process R&D in Silicon Valley. The R&D will take place at a new center in Union City, Calif., set up through co-investment, with construction starting in 2024 and full operation expected in 2025.

“US-JOINT expands the activities of Japan-based open consortiums led by Resonac in the U.S. and includes the participation of five U.S.-based companies.”eetimes.com

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• eetimes.comU.S. -Japan Packaging Venture Launched - EE TimesNews DeskJul 8, 2024

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