TOWA Corporation

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20222023202420252026

ExpansionPartnership

Jul 8, 2024PARTNERSHIPUnion City, California, United States
Resonac launches US-JOINT semiconductor packaging R&D consortium in Union City, California
Resonac Corporation unveiled a new consortium of ten partners called 'US-JOINT' for semiconductor back-end process R&D in Silicon Valley. The R&D will take place at a new center in Union City, Calif., set up through co-investment, with construction starting in 2024 and full operation expected in 2025.
Resonac Ulvac partner MEC partner KLA Corp. partner Kulicke & Soffa partner TOWA Corporation partner #Semiconductors and Industrial Electronics eetimes.com
Mar 24, 2022EXPANSIONUjitawara-cho, Tsuzuki-gun, Kyoto, Japanops 24 Mar 2022
TOWA completes new plant building at Kyoto East Plant for cutting tools
TOWA Corporation completed construction of a new plant building at its Kyoto East Plant to increase production capacity for cutting tools (endmills) and undertaking processing business, with total investment of about one billion yen.
TOWA Corporation #Industrial Machinery towajapan.co.jp

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Ujitawara-cho, Japan		2022-03-24

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