Resonac to invest ¥5.2B to boost semiconductor adhesive film capacity by 1.6x
Resonac will invest 5.2 billion yen to expand production capacity of dicing-die bonding integrated film for semiconductor packaging at its Goi plant in Kamisu, Japan, by about 1.6 times. Operations are scheduled to start in 2026.
Capacity
1.6 times current capacity
Productsdicing-die bonding integrated filmadhesive film for semiconductor packaging
“中長期的な需要拡大に対応すべく設備投資を実施”resonac.com
- 4 sources
- resonac.com半導体パッケージ用接着フィルムの生産能力を約1.6倍に増強 | News Releases | ResonacApr 4, 2023
- ap.resonac.comResonac Increases Production Capacity for Adhesive Film for Semiconductor Packaging by 60% - Resonac Asia PacificresonacApr 4, 2023
- prtimes.jp半導体パッケージ用接着フィルムの生産能力を約1.6倍に増強 | 株式会社レゾナック・ホールディングスのプレスリリースApr 4, 2023
- aei.dempa.netResonac Ramps up Production of Adhesive Film for IC Packaging | AEIuser_coronado-inguaApr 5, 2023
Summarized from public sources; check the original articles before acting on it.
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