Zhejiang Yaxin Microelectronics

Yaxin Microelectronics (Zhejiang Yaxin Microelectronics Co., Ltd.) has started construction of a semiconductor wafer manufacturing and chip packaging/testing project in Dongbao District, Jingmen, Hubei. The total investment is 40 billion yuan (approx. $5.5 billion), with Phase I (30 billion yuan) building a 6-inch wafer line and packaging/testing lines, and Phase II (10 billion yuan) adding a lead frame line.