Yaxin Microelectronics starts construction of $550M semiconductor plant in Jingmen

Yaxin Microelectronics (Zhejiang Yaxin Microelectronics Co., Ltd.) has started construction of a semiconductor wafer manufacturing and chip packaging/testing project in Dongbao District, Jingmen, Hubei. The total investment is 40 billion yuan (approx. $5.5 billion), with Phase I (30 billion yuan) building a 6-inch wafer line and packaging/testing lines, and Phase II (10 billion yuan) adding a lead frame line.

“项目投产后，可年产芯片100亿颗、晶圆100万片，年产值40亿元、税收8000万元以上”casmita.com

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• casmita.com总投资40亿元，亚芯微电半导体晶圆制造及芯片封测项目开工_项目动态_产业_新闻资讯_半导体产业网Apr 7, 2025

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