RRP Electronics

RRP Electronics has signed a MoU with Deca Technologies to acquire wafer-level chip packaging capabilities. RRP will invest $150 million to integrate Deca's WLCSP and FOWLP technologies, with qualification tests expected by August 2025.

RRP Electronics received mega project status from the Maharashtra state cabinet for a Rs 24,000 crore semiconductor project, which will include an OSAT facility at Mahape by September and a new plant at MIDC Taloja within two years, creating 4,000 jobs.

RRP Electronics plans to invest ₹5,000 crore over five years to set up a semiconductor OSAT facility in Maharashtra, with a foundation stone ceremony scheduled for March 23, 2024, and a second phase of ₹5,000 crore.