RRP Electronics signs MoU with Deca Technologies for wafer-level chip packaging

RRP Electronics has signed a MoU with Deca Technologies to acquire wafer-level chip packaging capabilities. RRP will invest $150 million to integrate Deca's WLCSP and FOWLP technologies, with qualification tests expected by August 2025.

“We are investing in a large-scale Technology Transfer License Agreement (TTLA) with Deca, potentially on exclusive terms, to create a fully automated, world-class infrastructure.”thehindu.com

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• thehindu.comRRP Electronics signs MoU with Deca Technologies to acquire wafer-level chip packaging capability - The HinduThe Hindu BureauFeb 26, 2025

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