Suzhou Keyang Semiconductor Co., Ltd.

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Aug 23, 2022INVESTMENTChina$59.0M
Suzhou Keyang Semiconductor plans $59M CIS chip packaging project
Suzhou Keyang Semiconductor Co., Ltd., a controlled subsidiary of Dagang Co., plans to invest approximately CNY 424 million (approx. USD 59 million) to build a 12-inch CIS chip TSV wafer-level packaging project with a capacity of 6,000 wafers per month. The project will be implemented in two phases.
Suzhou Keyang Semiconductor Co., Ltd.Dagang Co. investor #Semiconductors and Industrial Electronics zhitongcaijing.com

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China	$59.0M	2022-08-23

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