Suzhou Keyang Semiconductor plans $59M CIS chip packaging project

Suzhou Keyang Semiconductor Co., Ltd., a controlled subsidiary of Dagang Co., plans to invest approximately CNY 424 million (approx. USD 59 million) to build a 12-inch CIS chip TSV wafer-level packaging project with a capacity of 6,000 wafers per month. The project will be implemented in two phases.

“公司控股孙公司苏州科阳半导体有限公司拟使用自筹资金投资建设12吋CIS芯片TSV晶圆级封装项目，产能6000片/月，预计总投资约4.24亿元。”zhitongcaijing.com

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• zhitongcaijing.com大港股份(002077.SZ)：科阳半导体拟投约4.24亿元建12吋CIS芯片TSV晶圆级封装项目Aug 23, 2022

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