Beijing Yandong Microelectronics Co. Ltd.

Beijing is spending 33 billion yuan ($4.6 billion) to build a 12-inch wafer fabrication facility, led by Beijing Yandong Microelectronics (YDME) with a 24.95% stake, and including BOE Technology as an investor. The announcement was made on November 16, 2024.

Beijing Yandong Microelectronics Co. Ltd. (YDME) partnered with SilTerra Malaysia to set up an 8-inch wafer fabrication plant in Beijing, with an investment of 4.8 billion yuan (RM2.9 billion). The plant will cover 73,260 square metres and is expected to be in operation by Q1 2019 with a monthly output of 50,000 wafers.