Beijing Yandong Microelectronics leads $4.6B 12-inch wafer fab project

Beijing is spending 33 billion yuan ($4.6 billion) to build a 12-inch wafer fabrication facility, led by Beijing Yandong Microelectronics (YDME) with a 24.95% stake, and including BOE Technology as an investor. The announcement was made on November 16, 2024.

“Beijing is set to spend 33 billion yuan (US$4.6 billion) building a 12-inch wafer fabrication facility.”scmp.com

• 1 source
• scmp.comBeijing plans 12-inch wafer fab, pouring US$4.6 billion into state-backed chip project | South China Morning PostWency ChenNov 16, 2024

Summarized from public sources; check the original articles before acting on it.