Qualcomm Technologies

Qualcomm and USI announced a joint venture to build a Snapdragon SiP factory in Jaguariúna, Brazil. The site was announced as the future location for the factory.

Qualcomm Technologies, USI and ASUS announced the commercial launch of the ASUS ZenFone Max Shot and ZenFone Max Plus (M2) in Brazil, the first smartphones with the Qualcomm Snapdragon System-in-Package (SiP). The Snapdragon SiP was designed in Brazil through collaboration with the federal government.

Universal Global Electronics Co., Limited (USI subsidiary) and Qualcomm Technologies signed a joint venture agreement on February 6, 2018, to establish a company in São Paulo, Brazil, to develop and manufacture system-in-package (SiP) modules for smartphones and IoT. USI will invest $70.5 million (75%) and Qualcomm $23.5 million (25%), with total funding of $94 million.

Qualcomm Technologies and Universal Scientific Industrial (USI) signed an agreement to form a joint venture to install a semiconductor module facility in São Paulo, Brazil, dedicated to designing and fabricating modules for smartphones and IoT devices. The agreement is subject to closing conditions.

Qualcomm Technologies and ASE Group, with Brazilian government agencies, will invest $200 million to build a semiconductor chip manufacturing plant in Campinas, Brazil, creating 1,200 jobs.