USI subsidiary and Qualcomm Technologies to form SiP module joint venture in Brazil

Universal Global Electronics Co., Limited (USI subsidiary) and Qualcomm Technologies signed a joint venture agreement on February 6, 2018, to establish a company in São Paulo, Brazil, to develop and manufacture system-in-package (SiP) modules for smartphones and IoT. USI will invest $70.5 million (75%) and Qualcomm $23.5 million (25%), with total funding of $94 million.

“环旭电子之全资子公司环海电子与高通公司之全资子公司Qualcomm Technologies于北京时间2018年02月06日于巴西圣保罗签署合资协议，拟在巴西投资新设合资公司。”paper.cnstock.com

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• paper.cnstock.com环旭电子股份有限公司关于全资子公司对外投资设立合资公司并签订相关协议的公告|上海证券报Feb 7, 2018

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