Hon Hai Precision Industry (Foxconn)

Stellantis and Foxconn signed a non-binding MOU to form Mobile Drive, a 50/50 joint venture to develop advanced in-car digital cockpits and connected services. The JV will combine Stellantis' vehicle design with Foxconn's consumer electronics expertise.

Foxconn and TSMC are teaming up to make a joint bid for Toshiba Corp.'s semiconductor business, valued at $20 billion, according to sources. The bid is for a majority stake in Toshiba's memory chip unit.