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HLMC and Cypress Semiconductor announced production of low-power embedded flash products using HLMC's 55nm LP process with Cypress's SONOS IP, with full production expected in H2 2017.
Shanghai Huali Microelectronics Co. broke ground on a 38.7 billion yuan ($5.6 billion) wafer plant in Kangqiao, Pudong New Area, Shanghai on December 30, 2016, to manufacture advanced chips for smartphones, with production starting in 2018 and full capacity of 40,000 units monthly by 2022.
| Site | Largest | Latest |
|---|---|---|
| Kangqiao, China | $5.60B | 2017-01-03 |