Shanghai Huali Microelectronics breaks ground on $5.6B wafer plant

Shanghai Huali Microelectronics Co. broke ground on a 38.7 billion yuan ($5.6 billion) wafer plant in Kangqiao, Pudong New Area, Shanghai on December 30, 2016, to manufacture advanced chips for smartphones, with production starting in 2018 and full capacity of 40,000 units monthly by 2022.

“Huali’s wafer plant, located in Kangqiao in the Pudong New Area, will manufacture chips adopting the most advanced technology on the Chinese mainland”en.imsilkroad.com

• 1 source
• en.imsilkroad.comHuali’s plant to make advanced chips - Xinhua Silk RoadJan 3, 2017

Summarized from public sources; check the original articles before acting on it.