HLMC and Cypress launch 55nm embedded flash production

HLMC and Cypress Semiconductor announced production of low-power embedded flash products using HLMC's 55nm LP process with Cypress's SONOS IP, with full production expected in H2 2017.

“This embedded flash product has already entered risk production in 2016.”digitimes.com

• 1 source
• digitimes.comHLMC, Cypress announced the production of embedded flash products using 55nm low power process technology with SONOSPress releaseMar 31, 2017

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