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TOPPAN to build FC-BGA substrate plant in Singapore · Endata

◂ Announcements

Mar 20, 2024NEW FACILITYSingapore, Singapore

TOPPAN to build FC-BGA substrate plant in Singapore

TOPPAN, a group company of TOPPAN Holdings, will establish a new production base in Singapore for FC-BGA substrates used in high-density semiconductor packages. The plant has a floor area of 95,000 square meters and is scheduled to start operations at the end of 2026.

Starts operating

2026

Status

Announced

ProductsFC-BGA substrates

CompaniesToppan Toppan investor

Sectors#Semiconductors and Industrial Electronics

“TOPPANは、シンガポールに高密度半導体パッケージのFC-BGA基板の生産拠点を新設し、生産能力を拡大する。”dempa-digital.com

1 source
dempa-digital.comTOPPAN、シンガポールにFC－BGA基板生産の新拠点 | 電波新聞デジタルMar 19, 2024

Summarized from public sources; check the original articles before acting on it.

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