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Kostecsys wins ₩3.5 billion order from NXP for ceramic packages · Endata

◂ Announcements

Dec 27, 2023CONTRACT

Kostecsys wins ₩3.5 billion order from NXP for ceramic packages

Kostecsys signed a ₩3.5 billion contract with NXP to supply RF communication ceramic packages.

Value

$2.70M (3.50B KRW)

Status

Completed

ProductsRF communication ceramic packages

CompaniesNXP Semiconductors customer Kostecsys supplier

Sectors#Semiconductors and Industrial Electronics

“코스텍시스는 네덜란드 반도체 기업인 NXP와 35억원 규모 RF통신용 세라믹 패키지 수주계약을 체결했다고 27일 밝혔다.”thelec.kr

1 source
thelec.kr코스텍시스, NXP로부터 35억원 규모 수주계약 체결 < 반도체 < 기사본문 - 디일렉(THE ELEC)노태민 기자Dec 27, 2023

Summarized from public sources; check the original articles before acting on it.

More from NXP Semiconductors

Feb 19, 2024CONTRACTSouth Korea$2.77M
Costecsis wins KRW 3.7B RF communication package order from NXP
Costecsis NXP Semiconductors customer thelec.kr
Nov 8, 2023ACQUISITIONChina
NXP Semiconductors sells RF power business to JAC Capital
NXP Semiconductors partner Jianguang Asset Management acquirer avcj.com
Oct 27, 2023INVESTMENTGratkorn, Austria, Austria
NXP Semiconductors expands R&D in Austria with IPCEI ME/CT grants
NXP Semiconductors nxp.com
Aug 9, 2023INVESTMENTDresden, Germany, Germany$11.0B2,000 jobsops 2027
TSMC, Bosch, Infineon and NXP plan €10bn semiconductor fab in Dresden
European Semiconductor Manufacturing Company Bosch investor automotivepowertraintechnologyinternational.com packaginginsights.com
Aug 8, 2023ACQUISITIONDresden, Germany$10.9B2,000 jobs
TSMC, Bosch, Infineon, NXP form joint venture ESMC for Dresden fab
Robert Bosch investor Infineon Technologies AG investor infineon.com
Aug 8, 2023NEW FACILITYDresden, Germany, Germany$10.9Bops Q3 2024
TSMC to build €10B chip factory in Dresden, Germany
TSMC Bosch investor gtai.de reuters.com bloomberg.com

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