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TSMC, Bosch, Infineon, NXP form joint venture ESMC for Dresden fab · Endata

◂ Announcements

Aug 8, 2023ACQUISITIONDresden, Germany

TSMC, Bosch, Infineon, NXP form joint venture ESMC for Dresden fab

TSMC, Bosch, Infineon, and NXP plan to jointly invest over €10 billion in European Semiconductor Manufacturing Company (ESMC) GmbH to build a 300mm fab in Dresden, Germany, with production targeted by end of 2027.

Value

$10.9B (10.0B EUR)

Jobs

2,000

Status

Announced

Capacity

40,000 300mm wafers per month

Products300mm wafers on 28/22nm and 16/12nm process technologies

CompaniesRobert Bosch investor Infineon Technologies AG investor TSMC investor NXP Semiconductors investor European Semiconductor Manufacturing Company (ESMC) GmbH target

Sectors#Semiconductors and Industrial Electronics

“TSMC, Robert Bosch GmbH, Infineon Technologies AG, and NXP Semiconductors N.V. today announced a plan to jointly invest in European Semiconductor Manufacturing Company (ESMC) GmbH, in Dresden, Germany to provide advanced semiconductor manufacturing services.”infineon.com

1 source
infineon.comTSMC, Bosch, Infineon, and NXP Establish Joint Venture | Infineon TechnologiesAndre TauberAug 8, 2023

Summarized from public sources; check the original articles before acting on it.

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