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FICT, a printed circuit board developer and manufacturer, plans a total investment of about 30 billion yen over three years from fiscal 2022, including a new plant building at its Kurohime site in Shinano, Nagano, to boost semiconductor package substrate processing capacity by 1.4 times.
“FICTがパッケージ基板加工の増強に向けて建設した工場新棟の内部=信濃町”shinmai.co.jp
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