ASE breaks ground on K13 IC packaging and testing plant in Kaohsiung

Advanced Semiconductor Engineering (ASE) held a groundbreaking ceremony for its K13 plant in Kaohsiung. The plant will have 2 underground and 12 above-ground floors, total area over 32,000 sq m, and is expected to create 2,800 jobs. Construction investment is NTD 8 billion, with an additional NTD 18 billion for advanced packaging capacity. Completion expected in 2023.

“ASE stated that the K13 plant will take high-end packaging technology as the core.”semimedia.cc

• 2 sources
• semimedia.ccASE's K13 IC packaging & testing plant breaks ground - SemiMediaSemiMediaEditAug 17, 2020
• evertiq.comASE expands with new manufacturing fab in TaiwanDennis DahlgrenAug 19, 2020

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