Powerchip to build new 12-inch wafer fab in Taiwan

Powerchip Technology plans to build a new 12-inch wafer plant in the Tongluo campus of Hsinchu Science Park in Miaoli, Taiwan, with total investment estimated at nearly NT$300 billion (US$10.1 billion).

“Foundry chipmaker Powerchip Technology plans to build a new 12-inch wafer plant in the Tongluo campus of Hsinchu Science Park (HSP) in Miaoli, northern Taiwan with total investment estimated at nearly NT$300 billion (US$10.1 billion).”apps.digitimes.com

• 1 source
• apps.digitimes.comPowerchip to build new 12-inch wafer fabSiu Han, TaipeiMay 11, 2018

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