Powerchip and Broadcom establish panel-level advanced packaging JV in Singapore

Powerchip Technology Corp. and Broadcom Technologies Inc. established a joint venture, XCIP TECHNOLOGIES PTE. LTD., in Singapore for panel-level advanced packaging manufacturing. Total investment is USD 5.66 billion, with Powerchip contributing USD 400 million for a 30% equity stake.

“The total investment amounts to USD 5.66 billion, with Powerchip contributing USD 400 million for a 30% equity stake.”aeo.idaeo.ai

• 1 source
• aeo.idaeo.aiPowerchip and Broadcom Jointly Establish Panel-Level Advanced Packaging Manufacturing Joint Venture in Singapore (Supplement to Board Resolution Announcement on July 16, 115)Aug 7, 2026

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