Amkor Technology breaks ground on $7B semiconductor packaging campus in Arizona

Amkor Technology has broken ground on a new semiconductor advanced packaging and test campus in Arizona, with an expanded investment of $7 billion. The campus will include over 750,000 square feet of cleanroom space and create up to 3,000 jobs. Construction of the first facility is expected to be completed in mid-2027, with production beginning in early 2028.

“Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, in collaboration with the Trump Administration, today announces the groundbreaking and expanded planned investment of its new state-of-the-art outsourced semiconductor advanced packaging and test ”ir.amkor.com

• 1 source
• ir.amkor.comAmkor Technology Breaks Ground on New Semiconductor Advanced Packaging and Test Campus in Arizona; Expands Investment to $7 Billion | Amkor TechnologyOct 6, 2025

Summarized from public sources; check the original articles before acting on it.