Loading…

Amkor Technology has broken ground on a semiconductor packaging and testing campus in Peoria, Arizona, increasing its total investment to $7 billion across two phases. Construction is expected to finish in mid-2027, with production starting in early 2028.
“Amkor Technology has broken ground on a new semiconductor packaging and testing campus in Peoria, Arizona, the company announced Monday.”manufacturingdive.com
Summarized from public sources; check the original articles before acting on it.