HANMI Semiconductor invests 100 billion won in hybrid bonding technology

HANMI Semiconductor announced a 100 billion won investment to build a hybrid bonder factory in Incheon, South Korea, with completion targeted for the second half of 2026. The factory will produce next-generation equipment for HBM and AI packaging.

“HANMI Semiconductor announced on the 25th that it will invest 100 billion won in hybrid bonding technology.”biz.chosun.com

• 2 sources
• biz.chosun.comHANMI Semiconductor invests 100 billion won in next-gen hybrid bonding technology - CHOSUNBIZChun Byung-sooJul 25, 2025
• en.fnnews.com"Leading Next-Generation HBM Bonder" Hanmi Semiconductor Bets 100 Billion Won - First-Class Business Newspaper Financial NewsFinancial NewsJul 25, 2025

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