Hanmi Semiconductor signs KRW 8.05B supply contract with ASE

Hanmi Semiconductor signed a supply contract worth KRW 8.05 billion (USD 5.88 million) with Taiwan's ASE for FLIP CHIP BONDER semiconductor manufacturing equipment. The contract period runs from May 27, 2025 to September 26, 2025.

“The company signed a supply contract worth KRW 8.05B with Taiwan’s ASE for ‘FLIP CHIP BONDER’ semiconductor manufacturing equipment.”kstockbriefing.com

• 1 source
• kstockbriefing.com[Disclosure] Hanmi Semiconductor (042700) - Single Sales and Supply Contract (Voluntary Disclosure) / 2025-05-28 - K-Stock BriefingK-STOCK EditorMay 28, 2025

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