Tianshu Huatian Technology

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New facility

Mar 28, 2023NEW FACILITYNanjing, Jiangsu, China$415.4Mops Jun 2028
Tianshu Huatian to build $415M chip packaging plant in Nanjing
Tianshu Huatian Technology plans to build a CNY 2.9 billion (USD 415.4 million) advanced semiconductor packaging and testing factory in Nanjing, China, with annual capacity of 480,000 pieces of Wafer-level Chip Scale Packaging. Construction is expected to start in June 2023 and finish by June 2028.
Tianshu Huatian Technology #Semiconductors and Industrial Electronics yicaiglobal.com

Site	Largest	Latest
Nanjing, China	$415.4M	2023-03-28

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