Tianshu Huatian to build $415M chip packaging plant in Nanjing

Tianshu Huatian Technology plans to build a CNY 2.9 billion (USD 415.4 million) advanced semiconductor packaging and testing factory in Nanjing, China, with annual capacity of 480,000 pieces of Wafer-level Chip Scale Packaging. Construction is expected to start in June 2023 and finish by June 2028.

“The new plant is expected to generate CNY266 million (USD38.6 million) in net profit a year and revenue of CNY1.3 billion (USD183.1 million) once it is up and running.”yicaiglobal.com

• 1 source
• yicaiglobal.comChina’s Huatian to Spend USD415.4 Million on New Cutting-edge Chip Packaging PlantTang ShihuaMar 28, 2023

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