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Draper was selected as one of ten companies for a potential 10-year, $25.35 billion contract from the Defense Microelectronics Activity (DMEA) Advanced Technology Support Program (ATSP). The contract covers specialized engineering, secure microelectronics products, and system-level services.
Draper received two U.S. Department of Defense contracts totaling $14 million to expand domestic production capabilities for 3D ultra-high-density microelectronics modules, with i3 Microsystems as major subcontractor.