Draper awarded $14M DoD contracts for advanced packaging expansion

Draper received two U.S. Department of Defense contracts totaling $14 million to expand domestic production capabilities for 3D ultra-high-density microelectronics modules, with i3 Microsystems as major subcontractor.

“Draper announced today it has been selected for two U.S. Department of Defense (DoD) contracts, totaling $14 million, to enhance the U.S.’s ability for volume production of advanced packaging solutions for computer chips embedded within defense systems.”draper.com

• 1 source
• draper.comDraper Awarded $14M by DoD for Trusted Advanced Packaging Capability Expansion with i3 Microsystems as Major Subcontractor :: DraperMar 30, 2021

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