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The main structure of Qingdao HKC's six-inch wafer semiconductor power device project in Jimo, Qingdao, has been topped out. The project, with a total investment of 2.9 billion yuan, is expected to be put into production by the end of 2020, with an annual production scale of 2.4 million chips and 1 million advanced encapsulated chips.
| Site | Largest | Latest |
|---|---|---|
| Jimo, China | $448.0M | 2021-01-21 |