Qingdao HKC six-inch semiconductor project tops out in Jimo

The main structure of Qingdao HKC's six-inch wafer semiconductor power device project in Jimo, Qingdao, has been topped out. The project, with a total investment of 2.9 billion yuan, is expected to be put into production by the end of 2020, with an annual production scale of 2.4 million chips and 1 million advanced encapsulated chips.

“The project will be put into production at the end of 2020, after which it is expected to reach an annual production scale of 2.4 million chips and 1 million advanced encapsulated chips.”en.qdhkc.com.cn

• 1 source
• en.qdhkc.com.cnGood news | Qingdao HKC six inches semiconductors project main structure like sealing jinding!-Qingdao Huike | HKC Qingdao HuikeJan 21, 2021

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