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Beijing Huaton Chip Technology signed an agreement to build a third-generation compound semiconductor project in Shanghai Jinshan Industrial Zone. The project involves a total investment of 2.9 billion yuan ($410 million) and will produce GaAs and GaN chips for 5G base stations and radar.
| Site | Largest | Latest |
|---|---|---|
| Shanghai Jinshan Industrial Zone, China | $410.0M | 2020-06-22 |