Huaton Chip to build $410M compound semiconductor plant in Shanghai Jinshan

Beijing Huaton Chip Technology signed an agreement to build a third-generation compound semiconductor project in Shanghai Jinshan Industrial Zone. The project involves a total investment of 2.9 billion yuan ($410 million) and will produce GaAs and GaN chips for 5G base stations and radar.

“华通芯电第三代化合物半导体项目总投资29亿元，固定资产投资22.7亿元，计划用地50亩”semiunion.com

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• semiunion.com投资近30亿元的第三代化合物半导体项目落户上海金山-产业园区-半导体联盟semiunionJun 22, 2020

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