China Semiconductor Co., Ltd.

Woodson Semiconductor Technology will build a $3 billion (3 trillion won) semiconductor IDM project in Nanjing Economic and Technological Development Zone, producing OLED driver chips, display chips, and CIS image sensors. Construction of the first phase starts in October 2020, with trial production in April 2022. The project is a joint investment by China Semiconductor Co., Ltd. and Taiwan Xinguang International Group.

China Semiconductor Co., Ltd. and Taiwan Shin Kong Group jointly invested $3 billion to build an OLED display chip production project in Nanjing Economic and Technological Development Zone. The project, using an IDM model, will produce OLED display driver chips, silicon-based OLED display chips, and image sensor CIS chips, with a monthly capacity of 40,000 12-inch wafers and an annual output value exceeding 6 billion yuan.

Shanghai Woodson Electronics Technology Group, with China Semiconductor and Shin Kong Global Venture Capital, will build a semiconductor project in Nanjing, China, including a fab, packaging/test facility, and IC design center. Total investment is $3 billion.

Wusheng Semiconductor started a $3 billion IDM project in Nanjing Economic and Technological Development Zone on July 27, 2020. The project includes a wafer fab, packaging and testing plant, and IC design center, with phase one expected to start production in April 2022.

China Semiconductor Co., Ltd. and Xinguang International Investment Co., Ltd. signed an investment agreement with Nanjing Economic and Technological Development Zone for the Wusheng Semiconductor IDM project, with a total investment of $3 billion (RMB 21.24 billion). The project plans to produce 40,000 12-inch wafers per month for AMOLED display driver ICs, silicon-based OLED ICs, and CIS chips, with construction starting in Q4 2020.