Shanghai Woodson to build $3B semiconductor fab in Nanjing

Shanghai Woodson Electronics Technology Group, with China Semiconductor and Shin Kong Global Venture Capital, will build a semiconductor project in Nanjing, China, including a fab, packaging/test facility, and IC design center. Total investment is $3 billion.

“Construction of the first phase will start from October this year and is expected to be put into production in April next year, with a monthly output of 40,000 12-inch wafers.”english.jschina.com.cn

• 1 source
• english.jschina.com.cnMassive semiconductor project lands in Nanjing | ENGLISH.JSCHINA.COM.CNNickyJul 28, 2020

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