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Fuxin Semiconductor's analog chip IDM project, with a total investment of CNY 40 billion, will build a 12-inch wafer fab with 65-90nm process technology, producing power management analog chips for automotive, AI, mobile, smart home and industrial applications. The project is located in the Hangzhou High-tech Zone (Binjiang) Fuyang Special Cooperation Zone.
| Site | Largest | Latest |
|---|---|---|
| Hangzhou High-tech Zone (Binjiang) Fuyang Special Cooperation Zone, China | $5.60B | 2020-03-20 |