CanSemi Semiconductor

CanSemi Semiconductor signed a Phase 2 expansion project on February 28, 2020, adding 6.5 billion yuan ($930 million) in investment. The expansion will focus on 65-90nm analog process platforms, producing high-precision ADC chips, power management chips, optical sensors, and automotive chips. Combined Phase 1 and 2 capacity is expected to reach 40,000 12-inch wafers per month by 2022.