CanSemi Semiconductor signs Phase 2 expansion with $930M investment

CanSemi Semiconductor signed a Phase 2 expansion project on February 28, 2020, adding 6.5 billion yuan ($930 million) in investment. The expansion will focus on 65-90nm analog process platforms, producing high-precision ADC chips, power management chips, optical sensors, and automotive chips. Combined Phase 1 and 2 capacity is expected to reach 40,000 12-inch wafers per month by 2022.

“粤芯半导体二期扩产项目成功签约，二期建设将新增投资65亿元，专注于65-90nm模拟工艺平台。”m.cls.cn

• 2 sources
• m.cls.cn粤芯半导体二期扩产项目成功签约 新增投资65亿元Feb 28, 2020
• compoundsemiconductorchina.net粤芯半导体二期扩产项目成功签约--行业新闻频道-《化合物半导体》Mar 3, 2020

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