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BRIDG has been awarded a three-year contract by Radiance Technologies with a ceiling of $28 million to develop advanced semiconductor packaging technologies, leveraging BRIDG's 200mm microelectronics fabrication facility in NeoCity, Florida.
The U.S. Air Force Research Laboratory awarded BRIDG a $7.5 million contract to develop a secure digital twin for semiconductor capability, enabling validation of chip integrity. BRIDG will lead efforts to apply smart manufacturing and Industry 4.0 strategies for microelectronics security.