BRIDG awarded $28M contract by Radiance Technologies

BRIDG has been awarded a three-year contract by Radiance Technologies with a ceiling of $28 million to develop advanced semiconductor packaging technologies, leveraging BRIDG's 200mm microelectronics fabrication facility in NeoCity, Florida.

“BRIDG announced today that it has been awarded a contract by Radiance Technologies, Inc. (Radiance) to develop advanced semiconductor packaging technologies”gobridg.com

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• gobridg.comBRIDG Awarded $28M Contract by Radiance TechnologiesGloria LeQuangMay 21, 2020

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