CanSemi

CanSemi signed an agreement on February 28, 2020 to expand its second-phase 300mm wafer fab in Guangzhou, China, with a CNY 6.5 billion capital increase to build a 65-90nm analog process platform for chips including high-precision analog converters, power management ICs, optical sensors, and automotive and biosensors.

Guangzhou CanSemi Technology's 12-inch wafer project officially started production on September 20, 2019. Phase 1 investment was CNY10 billion with a capacity of 40,000 wafers per month.