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CanSemi signed an agreement on February 28, 2020 to expand its second-phase 300mm wafer fab in Guangzhou, China, with a CNY 6.5 billion capital increase to build a 65-90nm analog process platform for chips including high-precision analog converters, power management ICs, optical sensors, and automotive and biosensors.
“캔세미의 2기 공장을 위해 65억 위안(약 1조 1천115억 원)을 증자하고 65~90nm 아날로그 공정 플랫폼을 구축하는 것이 목표다.”kipost.net
Summarized from public sources; check the original articles before acting on it.